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More Super Hard tools company

More Super Hard Products Co., Ltd Is One Of The Leading Company Expert In Supplying Various Ultra Hard Products Including Synthetic Diamond Tools, Cubic Boron Nitride(CBN) Tools, Which Is Widely Used

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Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel

More Super Hard tools company
More Super Hard tools company
Country/Region: China
    Buy cheap Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel from wholesalers
     
    Buy cheap Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel from wholesalers
    • Buy cheap Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel from wholesalers

    Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel

    Ask Lasest Price
    Brand Name : more super hard
    Model Number : 1A1 14A1
    Certification : ISO9001
    Price : negotation
    Payment Terms : L/C, D/A, D/P, T/T, Western Union
    Supply Ability : 4000/months
    Delivery Time : 5-10days
    • Product Details
    • Company Profile

    Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel

    Diamond Back Grinding Wheels

    Diamond Back Grinding Wheels Are Used For Silicon Wafer Grinding. Our Advanced Technology Makes Back Grinding Wheel Possible To Grind All Types Of Semiconductor Wafers With Less Subsurface Damage.

    During Grinding, The Grinding Wheel And The Wafer Rotate About Their Own Rotation Axes Simultaneously, And The Wheel Is Fed Towards The Wafer Along Its Axis. The Rotation Axis For The Grinding Wheel Is Offset By A Distance Of The Wheel Radius Relative To The Rotation Axis For The Wafer.

    silicon wafer back grinding

    Applications Of Back Grinding Wheels:

    Back Thinning, Rough Grinding And Fine Grinding Of Silicon Wafer.

    Workpiece Processed Include Silicon Wafer Of Discrete Devices, Integrated Chips (IC) And Virgin Etc.

    Advantages Of Back Grinding Wheels:

    Good Self-Dressing Ability, Long Life And Low Prices.

    High Heat Conductivity, High Wear Resistance, And Low Coefficient.

    It Is Highly Desirable That Grinding Wheels Generate Only Very Low Damage To Ground Wafers.

    Applicable Grinding Machine:

    The Back Grinding Wheels Can Be Used For The Japanese ,German, American, Korean And Other Grinders . Such As Okamoto , Disco, Strasbaugh And Others Grinding Machine.

    The Specification Of Diamond Back Grinding Wheels:

    ModelDiameter (Mm)Thickness (Mm)Hole (Mm)
    6A2 back grinding wheels17530, 3576
    2003576
    35045127
    6A2T back grinding wheels19522.5, 25170
    28030228.6

    6A2T back grinding wheels

    6A2T (Three Ellipses)

    35035235
    20922.5158
    Other Size Can Ba Made According To Customers Requirements Email: Anna.wang@Moresuperhard.Com

    Quality Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel for sale
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